Octavio has over 30 years of engineering experience. He is currently Product & Test Engineering Vice President for Qualcomm’s RF and Mixed Signal products. This is his second time as an Engineering Vice President at Qualcomm. During his first tenure, he was responsible for Product & Test Engineering responsibilities for many key silicon product families. This included Qualcomm’s single-chip solution, RF transceivers, power amplifiers, power management, audio codecs and fingerprint sensors. He received Qualcomm’s Upendra Patel Engineering Excellence Award three years in a row for his leadership of Qualcomm’s single-chip product family, which produced more than one billion units. In between his Qualcomm tenures, Octavio was Vice President of Product Integrity for mixed reality products ay Microsoft and Vice President of Intel’s Manufacturing Product Engineering Organization. Martinez holds a master’s degree in business administration and a bachelor’s degree in electrical engineering, both from San Diego State University.